Double-sided module with electromagnetic shielding

A method comprising:

• providing a precursor package having a plurality of modules, wherein:
• inter-module areas are provided in between adjacent modules of the plurality of modules;
• each of the plurality of modules comprises a module substrate with a ground plane within the module substrate, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound provided at the top surface of the module substrate, and a plurality of first module contacts formed at a bottom surface of the module substrate and encapsulated by a second mold compound provided at the bottom surface of the module substrate;
• and
• the module substrate comprises at least one conductive element within the module substrate and electrically coupled to the ground plane and the first module contacts, wherein the at least one conductive element is positioned at a periphery of the module substrate, such that the at least one conductive element is adjacent to an edge of a corresponding inter-module area;
• sub-dicing the precursor package at each inter-module area to create an elongated cavity, wherein:
• the elongated cavity extends vertically from a top surface of the precursor package toward a bottom surface of the precursor package extending into the second mold compound without extending completely through the second mold compound;
• and
• the at least one conductive element associated with each of the plurality of modules is exposed to a corresponding elongated cavity;
• applying a shielding structure completely over the top surface of the precursor package, a side surface of the precursor package, and exposed faces of each elongated cavity to form a shielded package, wherein the shielding structure is in contact with the at least one conductive element associated with each of the plurality of modules to electrically couple the shielding structure to the ground plane;
• and
• singulating the shielded package into a plurality of shield modules, wherein a top surface and a side surface of each of the plurality of shield modules are completely covered by the shielding structure, and the shielding structure for each of the plurality of shielded modules remains electrically coupled to the ground plane.