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US 10,856,445 B2Granted
Electronic component housing apparatus and electronic device
AssigneeNEC Network and Sensor Systems, Ltd.
InventorsMasahiro Murakami, Norio Masuda
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AssigneeNEC Network and Sensor Systems, Ltd.
InventorsMasahiro Murakami, Norio Masuda
Estimating the term…
To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamber 5000 houses the high voltage power supply module 100 (the first electronic component). A second electronic component housing chamber 6000 houses the TWT 200 (the second electronic component). At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600.
An electronic component housing apparatus comprising:
An electronic device comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing: the coupling…
Details: mechanical details of casings
Constructional details common to different types of electric apparatus: modifications to facilitate cooling, ventilating, or heating
Forced ventilation, e.g. by fans: means for directing air flow, e.g. ducts, deflectors, plenum or guides
About 11 years 6 months of term left · ends 2 May 2038 (estimated)
The present invention relates to an electronic component housing apparatus and the like and, for example, relates to an electronic component housing apparatus and the like housing a heat-generating electronic component.
A microwave power module (MPM) is an amplifier module used in microwave band communication. A common microwave power module includes a traveling wave tube (TWT) and an electronic power conditioner (EPC). The EPC is also called a high-voltage power supply module.
The TWT outputs electric power ranging from several tens of watts (W) to several kilowatts (kW). Accordingly, the TWT generates high-temperature heat as a heating element.
FIG. 1 is a perspective view illustrating an internal configuration of an electronic device according to a first exemplary embodiment of the present invention.
FIG. 2 is a perspective view of an external appearance of the electronic device according to the first exemplary embodiment of the present invention viewed from the front side.
FIG. 3 is a perspective view of an external appearance of the electronic device according to the first exemplary embodiment of the present invention viewed from the back side.
A configuration of an electronic device 1000 according to a first exemplary embodiment of the present invention will be described. FIG. 1 is a perspective view illustrating an internal configuration of the electronic device 1000. FIG. 2 is a perspective view of an external appearance of the electronic device 1000 viewed from the front side. FIG. 3 is a perspective view of an external appearance of the electronic device 1000 viewed from the back side. FIG. 4 is a top view illustrating an internal configuration of the electronic device 1000. FIG. 5 is a perspective view illustrating an internal configuration of an electronic component housing apparatus 2000.
For example, the electronic device 1000 is a microwave power module. The microwave power module is a relatively new module and has both of an advantage of being high-power and highly efficient exerted by a TWT, and an advantage of being small-sized, high-gain, and low-noise exerted by a solid state amplifier (SSA). In the following description, the electronic device 1000 will be described as a microwave power module. For example, the electronic device 1000 is equipped on a satellite communication apparatus and a medical apparatus.
As illustrated in FIG. 1 or 4, the electronic device 1000 includes a high-voltage power supply module 100, a TWT 200, a heat sink 300, a first fan unit 400, a second fan unit 500, a control module 600, an inlet 700, an outlet 800, and an electronic component housing apparatus 2000. The high-voltage power supply module 100 is a first electronic component according to the present invention. Further, the TWT 200 is a second electronic component according to the present invention.