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US 10,856,444 B2Granted
Cooling device and electronic apparatus
AssigneeFujitsu Limited
InventorYoichi Sato
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AssigneeFujitsu Limited
InventorYoichi Sato
Estimating the term…
A cooling device includes a heat reception base configured to receive heat transmitted from an electronic component. The cooling device also include a fin base configured to face the heat reception base. The fin base is also configured to form a ventilation path through which air flows between the fin base and the heat reception base. A heat conductor coupled with the heat reception base and the fin base is also included. The cooling device also includes a plurality of radiation fins configured to extend from the fin base to a side opposite to the heat reception base. The fin base includes an air outlet configured to communicate with a gap between the radiation fins adjacent to each other.
A cooling device comprising:
An electronic apparatus comprising:
An electronic component cooling device comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
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Constructional details or arrangements: cooling means
About 12 years 6 months of term left · ends 29 Apr 2039 (estimated)
This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2018-96033, filed on May 18, 2018, the entire contents of which are incorporated herein by reference.
The technology disclosed in the application is related to a cooling device and an electronic apparatus.
There is a heat sink that cools an electronic component (for example, refer to Japanese Laid-open Patent Publication No. 2007-13052 and Japanese Laid-open Patent Publication No. 05-95062). This type of heat sink is provided with, for example, a case to be brought into contact with the electronic component, a plurality of radiation fins arranged in the case, and a blower that supplies cooling air into the case and cools the radiation fins.
FIG. 1 is a perspective view illustrating a cooling device according to one embodiment;
FIG. 2 is a longitudinal sectional view of the cooling device illustrated in FIG. 1;
FIG. 3 is an exploded perspective view of the cooling device illustrated in FIG. 1;
In a heat sink of the related art, it is difficult to supply cooling air to each of the plurality of the radiation fins, and there is a possibility that heat radiation efficiency of the plurality of the radiation fins is lowered.
Hereinafter, an embodiment of a technique capable of enhancing the heat radiation efficiency of the plurality of the radiation fins will be described.
In FIGS. 1 and 2, a cooling device 10 according to the present embodiment is illustrated. The cooling device 10 is, for example, an air-cooling type cooling device which is attached to an electronic component 12 (refer to FIG. 2) such as a central processing unit (CPU) that generates heat and accelerates heat radiation of the electronic component 12 to cool the electronic component 12. The cooling device 10 includes a heat sink 20, a case 50, and a high static pressure air generator (not illustrated).