Cladded metal structures for dissipation of heat in a portable electronic device

#The described embodiments relate generally to cladded metal structures for portable electronic devices. More particularly, the described embodiments relate to a support structure that includes a core and cladded metal structures for dissipating thermal energy generated by operational components of a portable electronic device.

#Recent technological advances have enabled manufacturers in the portable electronic device industry to integrate a large number of operational components (e.g., processors, antennas, displays, haptic feedback components, etc.) in a small cavity of a single enclosure of a portable electronic device. However, because of the small cavity and the types of materials utilized in the enclosure (e.g., glass, ceramic, etc.), there is an excessive amount of heating within the portable electronic device. Consequently, operation of the portable electronic device can suffer due to the excessive amount of heating. For example, over-heating within the cavity of the portable electronic device can lead to premature failure of certain operational components. Accordingly, there is a need for the enclosure to include structures that are capable of effectively dissipating the heat generated by these operational components.

#This paper describes various embodiments that relate generally to cladded metal structures for portable electronic devices. More particularly, the described embodiments relate to a support structure that includes a core and cladded metal structures for dissipating thermal energy generated by operational components of a portable electronic device.

#The disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements.

#FIGS. 1A-1B illustrate various views of portable electronic devices that includes a support structure having cladded metal structures, in accordance with some embodiments.

#FIGS. 2A-2C illustrate various views of a portable electronic device that includes a support structure having cladded metal structures, in accordance with some embodiments.

#Representative applications of methods and apparatus according to the present application are described in this section. These examples are being provided solely to add context and aid in the understanding of the described embodiments. It will thus be apparent to one skilled in the art that the described embodiments may be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail in order to avoid unnecessarily obscuring the described embodiments. Other applications are possible, such that the following examples should not be taken as limiting.

#In the following detailed description, references are made to the accompanying drawings, which form a part of the description and in which are shown, by way of illustration, specific embodiments in accordance with the described embodiments. Although these embodiments are described in sufficient detail to enable one skilled in the art to practice the described embodiments, it is understood that these examples are not limiting; such that other embodiments may be used, and changes may be made without departing from the spirit and scope of the described embodiments.

#The embodiments described herein relate generally to support structures for portable electronic devices. In particular, the support structures can refer to support plates, stiffening plates, mid-plates, cladded metal structures, and the like that are capable of dissipating thermal energy generated by operational components of a portable electronic device. As described herein, the term dissipation can refer to the transformation of mechanical energy into energy dissipation. The term thermal dissipation can also be referred to as thermal conduction.