System and method for bi-side heating vapor chamber structure in an information handling system

A method, comprising:

• thermally attaching a first heat generating region of a first device of an information handling system to a first hot surface on a first side of a cooling device;
• transmitting first heat from the first heat generating region to a first cold surface on a second side of the cooling device;
• thermally attaching a second heat generating region of a second device of the information handling system to a second hot surface on the second side of the cooling device;
• and
• transmitting second heat from the second heat generating region to a second cold surface on the first side of the cooling device.

A vapor chamber to remove first heat from a first device and to remove second heat from a second device, the vapor chamber comprising:

• a first hot surface on a first side of the vapor chamber to receive the first heat from the first device;
• a first cold surface on a second side of the vapor chamber to receive the first heat from the first hot surface;
• a second hot surface on the second side of the vapor chamber to receive the second heat from the second device;
• and
• a second cold surface on the first side of the vapor chamber to receive the second heat from the second hot surface.