Apparatus and method for cooling an electronic assembly
AssigneeHENSOLDT Sensors GmbH
InventorsJoerg Sander, Tim Moser
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AssigneeHENSOLDT Sensors GmbH
InventorsJoerg Sander, Tim Moser
Estimating the term…
An apparatus configured to cool an electronic assembly includes an evaporator configured to evaporate a cooling medium using heat of the electronic assembly, and a power transformer configured to transform energy stored in the evaporated cooling medium into electric power. The cooling medium has an evaporating temperature at atmospheric pressure within a temperature range of 50° C. to 80° C.
An apparatus configured to cool an electronic assembly, the apparatus comprising:
An electronic assembly including:
A method for cooling an electronic assembly comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
Plants or engines characterised by use of special working fluids, not otherwise provided for; Plants operating in closed cycles and not…
Using a liquid coolant with phase change in electronic enclosures: evaporators
Using special vapours: using industrial or other waste gases
For power electronics, e.g. for inverters for controlling motor: liquid coolant with phase change
About 12 years 10 months of term left · ends 6 Sep 2039 (estimated)
This application claims priority under 35 U.S.C. § 119 from European Application No. 18193184.1, filed Sep. 7, 2018, the entire disclosure of which is herein expressly incorporated by reference.
The present invention relates to an apparatus and to a method for cooling an electronic assembly and in particular to a cooling system with an integrated power generation.
Modern electronic systems exhibit an increasing power consumption resulting in a significant heating of these systems. This heating may deteriorate not only the performance, but limits also the reliability and functionality of the corresponding electronic assembly.
Various embodiments of the present invention will be described in the following by way of examples only, and with respect to the accompanying drawings, in which:
FIG. 1 depicts an apparatus for cooling an electronic assembly according to an embodiment of the present invention.
FIG. 2 illustrates further details the power transformer according to embodiments of the present invention.
Various examples will now be described more fully with reference to the accompanying drawings in which some examples are illustrated.
Accordingly, while examples are capable of various modifications and alternative forms, the illustrative examples in the figures and will herein be described in detail. It should be understood, however, that there is no intent to limit examples to the particular forms disclosed, but on the contrary, examples are to cover all modifications, equivalents, and alternatives falling within the scope of the disclosure. Like numbers refer to like or similar elements throughout the description of the figures.
It will be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.).