Socket connector and cable assembly for a communication system

#The subject matter herein relates generally to a communication system.

#The ongoing trend toward smaller, lighter, and higher performance electrical components and higher density electrical circuits has led to the development of surface mount technology in the design of printed circuit boards and electronic packages. Surface mountable packaging allows for a separable connection of an electronic package, such as an integrated circuit or a computer processor, to pads on the surface of the circuit board rather than by contacts or pins soldered in plated holes going through the circuit board. Surface mount technology may allow for an increased component density on a host circuit board, thereby saving space on the host circuit board. Conventional architecture includes electrical paths defined through the host circuit board to electrical components mounted to the host circuit board remote from the electronic package. The electrical paths are defined by circuit traces routed between the electronic package and the electrical components. The routing of the circuits between the electronic package and the electrical components occupy board space on the host circuit board. Additionally, the electrical performance of the communication system is reduced by the long lengths of the circuit traces. Conventional systems are struggling with meeting signal output while maintaining good electrical performance through the system.

#A need remains for a communication system having improved electrical performance.

#FIG. 1 illustrates a communication system formed in accordance with an exemplary embodiment.

#FIG. 2 is a perspective view of a portion of the communication system showing socket connector assemblies in accordance with an exemplary embodiment.

#FIG. 3 is a perspective view of the socket connector assembly in accordance with an exemplary embodiment.

#FIG. 1 illustrates a communication system 100 formed in accordance with an exemplary embodiment. The communication system 100 includes one or more socket connector assemblies 102 electrically connected to an electronic package 104, such as an integrated circuit. Each socket connector assembly 102 includes a socket connector 106 (shown in some socket connector assemblies 102) and a cable assembly 108 (shown in other socket connector assemblies 102) coupled to the socket connector 106. The electronic package 104 and the socket connectors 106 are coupled to a host circuit board 110, such as a motherboard. The socket connector 106 is electrically connected to the electronic package 104 through the host circuit board 110. The socket connector 106 electrically connects the electronic package 104 with the cable assembly 108. In various embodiments, the electronic package 104 may be directly coupled to the host circuit board 110, such as soldering the electronic package 104 using a ball grid array of solder balls. In other various embodiments, the electronic package 104 may be coupled to the host circuit board 110 using a socket connector.

#In the illustrated embodiment, the electronic package 104 is coupled to the top of the host circuit board 110 at a primary mating area 112 and the socket connector assemblies 102 are coupled to the top of the host circuit board 110 at secondary mating areas 114. The electronic package 104 may transmit high speed data, low speed data and/or power through the interface between the electronic package 104 and the host circuit board 110. The socket connectors 106 may transmit high speed data, low speed data and/or power through the interface between the socket connectors 106 and the host circuit board 110. In an exemplary embodiment, high speed data signals may be transmitted between the socket connector assemblies 102 and the electronic package 104. The secondary mating areas 114 are in close proximity to the primary mating area 112, such as immediately adjacent the primary mating area 112. As such, the socket connector assemblies 102 are located in close proximity to the electronic package 104, such as immediately adjacent to the electronic package 104. As such, the circuit traces of the host circuit board 110 connecting the socket connector assemblies 102 and the electronic package 104 are relatively short. The circuit traces have little signal degradation along the short circuit traces between the electronic package 104 and the socket connector assemblies 102. The socket connector assemblies 102 may be arranged in multiple rows. In the illustrated embodiment, the socket connector assemblies 102 are arranged at two opposite sides of the electronic package 104 (for example, in an East/West orientation), leaving the other two sides (for example, North/South) open for airflow through the communication system 100. Other arrangements are possible in alternative embodiments. Other components may be coupled to the host circuit board 110 at tertiary mating areas.

#The electronic package 104 may be any type of component, such as a data communication device. For example, the electronic package 104 may be an integrated circuit, such as an application-specific integrated circuit (ASIC), a chip, a microprocessor, and the like. In other various embodiments, the electronic package 104 may be an electrical connector, such as a high speed differential pair receptacle connector, a header connector, a card edge connector, and the like. The electrical connector may define an interface for interfacing with another mating connector, such as a cable connector, a paddle card connector, or another type of mating connector.