Method for manufacturing stretchable electronic device

#The present disclosure relates to a stretchable conductive connection-based stretchable electronic device and a method for manufacturing the same, and more particularly, to a stretchable conductive connection-based stretchable electronic device and a method for manufacturing the same, which minimizes stress/strain applied to an electric part.

#Recently, interest in a wearable electronic device is increasing. The wearable electronic device may occur a problem that the performance of a high-performance Integrated Circuit chip is deteriorated due to the strain and stress such as tensile, compression, or bending.

#A conventional IC chip is connected by solder on the two-dimensional plane of a rigid Printed Circuit Board (PCB), and susceptible to external mechanical strain because the electrical contact portion and the PCB itself are not flexible/stretchable.

#FIG. 1A is a side diagram showing a stretchable electronic device according to an embodiment of the present disclosure.

#FIG. 1B is a side diagram showing a stretchable electronic device according to another embodiment of the present disclosure.

#FIG. 2 is a plane diagram showing a stretchable board and a plurality of stretchable conductive connecting bodies constituting the stretchable electronic device according to an embodiment of the present disclosure.

#Other advantages and features of the present disclosure and the method for achieving them will become apparent with reference to the embodiments, which will be described in detail below together with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below, and the present disclosure is only defined by the scope of the claims. Even unless defined, all terms (including technical or scientific terms) used herein have the same meaning as those generally received by a general technology in the related art.

#In the description of the present disclosure, a detailed description of known technology related to the present disclosure may be omitted when it is determined to unnecessarily obscure the subject matter of the present disclosure. Then, the following terms are terms defined considering the functions of the present disclosure, and this may be changed according to the intention or the custom of a user and an operator, etc. Therefore, the definition should be based on the contents throughout this specification. In the drawings of the present disclosure, the same reference numerals are used as many as possible for the same or corresponding configurations. To facilitate understanding of the present disclosure, some configurations in the drawings may be shown somewhat exaggerated or reduced.

#The following description is only one means for efficiently explaining the technical sprit of the present disclosure for those skilled in the art to which the present disclosure pertains, and the terms used in the present application are used for explaining only specific embodiments and are not intended to limit the present disclosure. The singular expressions include plural expressions unless the context clearly dictates otherwise.