Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit board

#This application is a U.S. national phase application filed under 35 U.S.C. § 371 of International Application No. PCT/JP2017/001133, filed Jan. 13, 2017, designating the United States, which claims benefit from Japanese Patent Application 2016-006478, filed Jan. 15, 2016, which are hereby incorporated herein by reference in their entirety.

#The present invention relates to a prepreg, a printed circuit board, a semiconductor package, and a method for producing a printed circuit board.

#Recently, against the background of environmental problems such as global warming, demands such as reduction of CO2 and energy saving have been increasing. Accordingly, for example, hybrid engines, fuel cells, electric vehicles, and the like have been developed in the automobile field. Further, renewable energy such as solar cells and wind power generation has been promoted from the viewpoint of breaking with nuclear power generation.

#FIG. 1 is a schematic cross-sectional view illustrating a prepreg relating to an exemplary embodiment (Example 1) of the present invention.

#FIG. 2 is a schematic cross-sectional view illustrating the definition of the thickness in the prepreg of the present invention.

#FIG. 3 is a conceptual view illustrating a laminating order at the time of producing a printed circuit board in Example 1.

#Hereinafter, exemplary embodiments of the prepreg of the present invention will be described with reference to the drawings.

#In the following description, the same or equivalent parts are denoted by the same reference numerals, and a repeated description will be omitted. Further, the positional relationships such as up, down, left, and right are based on the positional relationships illustrated in the drawings unless otherwise specifically mentioned. In addition, the dimensional ratios of the drawings are not limited to the illustrated ratios.

#[Prepreg]