Circuit board
AssigneeUnimicron Technology Corp.
InventorsChing-Hao Huang, Ho-Shing Lee, Yu-Cheng Lin
Life of this patent
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Abstract
A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.
Claims4
A circuit board disposed on a substrate and comprising:
- a dielectric layer disposed on the substrate;
- and
- a circuit layer embedded in the dielectric layer and having a plurality of traces, each of the traces having a first top surface and a first bottom surface which are opposite to each other, wherein the first bottom surface faces toward the substrate, the first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate, and the circuit layer comprises a second metal layer and a third metal layer, and the first top surface is located on the second metal layer, and the first bottom surface is located on the third metal layer, and densification of the third metal layer is greater than the densification of the second metal layer, wherein the second and third metal layers are electroplated copper.
Dependencies are inferred from the claim text.