The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.
Drawings
Claims13
A power supply module used in a smart terminal, comprising:
a substrate having first and second surfaces opposite to each other;
a power passive element, an active element and a plurality of first conductive parts disposed at the substrate;
the power passive element being independently disposed on the first surface of the substrate as a whole;
wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of any element disposed on the second surface of the substrate and a half of the thickness of the substrate;
wherein the first surface at the opposite edges of the substrate is retracted relative to the second surface to form an inclined surface;
wherein the first conductive parts are disposed at the inclined surface.
3 more elements
A power supply module assembly structure used in a smart terminal, comprising a system board and a power supply module, the power supply module comprises:
a substrate having first and second surfaces opposite to each other;
a power passive element, an active element and a plurality of first conductive parts disposed at the substrate;
the power passive element being independently disposed on the first surface of the substrate as a whole;
wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of any element disposed on the second surface of the substrate and half of the thickness of the substrate;
the system board having first and second surfaces opposite to each other, an opening through the first and second surfaces of the system board, and a plurality of second conductive parts located at the system board;
wherein,
the power passive element passing through the opening, and the first conductive parts of the substrate and the second conductive parts of the system board being fixed and electrically connected, such that the power supply module being electrically connected to the system board;
wherein the first surface of the substrate is retracted relative to the second surface to form an inclined surface at the opposite edges, the first conductive parts are disposed at the inclined surface;
and the edge of the opening of the system board is configured as an inclined surface in match with the edge of the substrate, and the second conductive parts are disposed at the inclined surface of the opening of the system board.
22 Feb 2039Estimated · howhide20 years from earliest known nonprovisional domestic filing plus recorded patent term adjustment, including 23 days of adjustment. Maintenance-fee lapses, terminal disclaimers and statutory extensions have not been checked. The continuity chain may be incomplete; this is not an enforceability determination.
#This application is based on and claims priority to Chinese Patent Application 201810131380.0, filed on Feb. 9, 2018, the entire contents thereof are incorporated herein by reference.
#The present disclosure relates to an electronic power technical field, particularly to a power module for a smart terminal and a power module assembling structure.
#Recently, the cloud computing, network technology and various smart terminal (or called intelligent terminal) develop rapidly, in particular, the smart terminal markets, such as mobile phones and IPADs which's markets are huge in scale and are growing rapidly. Wherein, switching power supply is generally used in above mentioned applications to ensure conversion efficiency of a power supply system. However, the integration of the switching power supply is often not high enough due to its complicated circuit, which limits the wide application of the switching power supply in such type of devices.
Brief description of the drawings27 figures
#FIG. 1A is a schematic view of a power supply module in related art applied to a mobile phone.
#FIG. 1B is a schematic view of a power supply module in related art.
#FIG. 2 is a perspective view of a power supply module applied to a smart terminal according to one embodiment of the present disclosure.
Detailed description4,438 words
#Now, the exemplary embodiments will be described more fully with reference to the accompany drawings. However, the exemplary embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Instead, these embodiments are provided so that this disclosure will be thorough and complete, and the concept of the exemplary embodiment will fully convey to those skilled in the art. For view of clarity, thickness of the area and the layer may be exaggerated. Same reference signs denote the same or similar structures in the accompany drawings, and thus the detailed description thereof will be omitted.
#Furthermore, the described features, structures, or characteristics may be incorporated into one or more embodiments in any suitable manner. Hereinafter, numerous specific details are provided such that the embodiments of the present disclosure will be understood sufficiently. However, it should be appreciated for the person skilled in the art that the technical solution of the present disclosure may be implemented without one or more of specific details, or other methods, elements, materials, and the like may be employed. Under other circumstances, the well-known structures, materials, or operations are not shown or described to avoid obscuring the major technical idea of the present disclosure.
#The present disclosure provides a power supply module used in a smart terminal (or maybe named intelligent terminal). As shown in FIG. 2 to FIG. 4, the power supply module includes a substrate 10 having a first surface 11 and a second surface 12 opposite to each other. In FIG. 2, the first surface 11 is the lower surface of the substrate 10, and the second surface 12 is the upper surface of the substrate 10. The substrate 10 is provided with active element 30, power passive element 40, a plurality of first conductive parts 20 and other elements.