US 10,856,415 B2Granted

Printed wiring board and method for manufacturing the same

AssigneeIbiden Co., Ltd.

InventorIkuya Terauchi

Life of this patent

Estimating the term…

Loading patent…

Abstract

A printed wiring board includes a conductor layer including first and second pads, a coating layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, and metal bumps including a first bump on the first pad and a second bump on the second pad such that the first and second bumps protrude from the coating layer. The first and second openings are formed such that diameter of the second pad is smaller than diameter of the first pad. The first and second bumps are formed such that height of protruding portion of the first bump from the surface of the coating layer is substantially equal to height of protruding portion of the second bump from the surface of the coating layer and that the second bump covers an area of the coating layer on the surface surrounding the second opening.

Claims20

Dependent claims

A printed wiring board, comprising:

an insulating layer;
a conductor layer formed on the insulating layer and including a first conductor pad and a second conductor pad;
a coating insulating layer formed on the insulating layer such that the coating insulating layer is covering the conductor layer and has a first opening portion exposing the first conductor pad and a second opening portion exposing the second conductor pad;
and
a plurality of metal bumps comprising a first metal bump formed on the first conductor pad and a second metal bump formed on the second conductor pad such that the first and second metal bumps protrude from a surface of the coating insulating layer on an opposite side with respect to the insulating layer,
wherein the first and second opening portions of the coating insulating layer are formed such that a diameter of the second conductor pad is smaller than a diameter of the first conductor pad, and the first and second metal bumps are formed such that a height of a protruding portion of the first metal bump relative to the surface of the coating insulating layer is substantially equal to a height of a protruding portion of the second metal bump relative to the surface of the coating insulating layer and that the second metal bump has a flared portion entirely covering an area of the coating insulating layer on the surface completely surrounding an outer periphery of the second opening portion.

3 more elements

A method for manufacturing a printed wiring board, comprising:

forming a conductor layer including a first conductor pad and a second conductor pad on an insulating layer;
forming a coating insulating layer on the insulating layer such that the coating insulating layer covers the conductor layer;
forming a first opening portion and a second opening portion in the coating insulating layer such that the first opening portion penetrates through the coating insulating layer and exposes the first conductor pad from the coating insulating layer and that the second opening portion penetrates through the coating insulating layer and exposes the second conductor pad from the coating insulating layer;
and
forming a plurality of metal bumps including a first metal bump filling the first opening portion and formed on the first conductor pad, and a second metal bump filling the second opening portion and formed on the second conductor pad such that a height of a protruding portion of the first metal bump relative to a surface of the coating insulating layer is substantially equal to a height of a protruding portion of the second metal bump relative to the surface of the coating insulating layer and that the second metal bump has a flared portion entirely covering an area of the coating insulating layer on the surface completely surrounding an outer periphery of the second opening portion,
wherein the first and second opening portions of the coating insulating layer are formed such that a diameter of the second conductor pad is smaller than a diameter of the first conductor pad.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/684,639Filed 15 Nov 2019
Priority: JP 2018-21469615 Nov 2018
Published: US 2020/0163214 A121 May 2020
Granted: 1 Dec 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

H05K 1/111
Printed elements for providing electric connections to or between printed circuits: pads for surface mounting, e.g. lay-out
H05K 1/113
Directly combined with via connections: via provided in pad; Pad over filled via
H05K 1/185
Associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]: associated with components encapsulated…
H05K 3/244
Reinforcing of the conductive pattern: finish plating of conductors, especially of copper conductors, e.g. for pads or lands