US 10,856,413 B2 · Segmented stretchable/conformable electronic and optoelectronic circuit on stretchable backplane

Abstract

A fabrication method for stretchable/conformable electronic and optoelectronic circuits and the resulting circuits. The method may utilize a variety of electronic materials including, but not limited to Silicon, GaAs, InSb, PbSe, CdTe, organic semiconductors, metal oxide semiconductors and related alloys or hybrid combinations of the aforementioned materials. While a wide range of fabricated electronic/optoelectronic devices, circuits, and systems could be manufactured using the embodied technology, a hemispherical image sensor is an exemplary advantageous optoelectronic device that is enabled by this technology. Other applications include but are not limited to wearable electronics, flexible devices for the internet-of-things, and advanced imaging systems.

Claims12

Dependent claims

A device comprising:

a wafer-based circuit including a plurality of circuit elements distributed across top surfaces of a plurality of spatially-separated wafer segments, wherein the plurality of wafer segments are formed from silicon, wherein the wafer segments include one or more through-silicon vias to electrically connect circuit elements of the wafer-based circuit on the top surfaces to interconnect points on bottom surfaces of the wafer segments;
a continuous single backplane comprising a polymer, wherein the backplane is connected to the bottom surfaces of the wafer segments, wherein the backplane is at least one of stretchable or flexible;
one or more interconnects integrated with the backplane to provide selected electrical connections between selected interconnect points of the plurality of wafer segments.

Dependencies are inferred from the claim text.

Facts

Application

15/948,065Filed 9 Apr 2018 · us provisional application

Priority

7 Apr 2017

Published

US 2018/0295722 A111 Oct 2018

Granted

1 Dec 2020

Term ends

Not estimatedThe source records don’t support an estimate.

Classification15 codes

H05K 1/0393
Use of materials for the substrate: flexible materials
G02B 13/0085
Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras: employing wafer level optics
H10F 39/8063
Optical elements or arrangements associated with the image sensors: microlenses
H10K 77/111
Substrates, e.g. flexible substrates: flexible substrates

Segmented stretchable/conformable electronic and optoelectronic circuit on stretchable backplane

Life of this patent

Segmented stretchable/conformable electronic and optoelectronic circuit on stretchable backplane

Life of this patent

Abstract

Claims12