Substrate

#This patent application is a national phase filing under section 371 of PCT/EP2019/069823, filed Jul. 23, 2019, which claims the priority of German patent application 102018118016.0, filed Jul. 25, 2018, each of which is incorporated herein by reference in its entirety.

#The present invention relates to a substrate which comprises a ceramic main body.

#Substrates are widespread component parts in industrial production, in order to arrange and to contact microelectronic components such as integrated circuits and power semiconductors such as LEDs thereon. The microelectronic components and power semiconductors thus mounted can subsequently be easily integrated into further electronic components.

#The invention is described in greater detail below with reference to exemplary embodiments and accompanying figures.

#FIG. 1 shows a schematic cross-section of an embodiment of the substrate;

#FIG. 2 shows a schematic cross-section of an embodiment of the substrate having inner redistribution layers;

#The same elements, similar or apparently identical elements are provided with the same reference numerals in the figures. The figures and the proportions regarding size in the figures are not true to scale.

#FIG. 1 shows a schematic cross-section of an embodiment of a substrate, having a ceramic main body 1, a passivation layer 12 on a first outer face 9 and on a second outer face 10 of the ceramic main body 1. Moreover, organic surface structures 2 are configured on the passivation layers 12. The passivation layers 12 are, for example, 100 nm thick and contain by way of example SiN. The passivation layers 12 protect the ceramic main body 1 against corrosion, for example, due to aggressive solvents which are deployed during the manufacture of the organic surface structure 2. Outer redistribution layers 3 are additionally integrated into the organic surface structures 2. By virtue of the organic surface structures 2 on the first outer face 9 and the second outer face 10, it is possible to contact the microelectronic components and power semiconductors (not depicted) mounted on the first outer face 9 by way of vias 4 by means of contacts 5 which are configured on the second outer face 10. This type of contacting makes, for example, the transition from a contacting plane having relatively large contact distances to a contacting plane having relatively small contact distances possible. Moreover, the ceramic main body comprises AlN as the main constituent which has a thermal conductivity of more than 100 W/m·K. This makes a highly efficient dissipation of the heat possible which is given off by microelectronic components and power semiconductors (not depicted) mounted on the substrate. This efficiently prevents overheating of the same. In combination with the organic surface structure 2, which makes a sufficiently high number of outer redistribution layers 3 possible, it is possible to reduce distances between components mounted on the substrate and, consequently, make possible further miniaturization and an improvement in performance.

#FIG. 2 shows a schematic cross-section of a further embodiment of a substrate. In addition to the embodiment according to FIG. 1, the ceramic main body 1 has inner redistribution layers 6. Thanks to the inner redistribution layers 6, it is possible to integrate heavily loaded lines into the ceramic main body 1, which has a better thermal conductivity than conventional polymer-based substrates. This constitutes a further protection of the microelectronic components and power semiconductors (not depicted) mounted on the substrate against overheating. As a result, it is possible to increase the number of the microelectronic components and power semiconductors mounted on the substrate on a given face of the substrate. This effectively prevents overheating of the same. This makes a more compact design of the substrate possible.