Printed wiring board

An electronic apparatus comprising:

• a printed wiring board comprising:
• a multi-layer substrate;
• a power line, laid on the multi-layer substrate and connected with a first row of power terminals of a semiconductor device;
• and
• a ground line, laid on the multi-layer substrate and connected with a first row of ground terminals of the semiconductor device;
• wherein,
• at least one of the power line or the ground line comprises:
• a first wiring pattern, formed on a surface of the multi-layer substrate;
• and
• a second wiring pattern, formed within the multi-layer substrate;
• a switch line, laid on the multi-layer substrate and connected with a first row of switch terminals of the semiconductor device, wherein the switch line is partially between the power line and the ground line from a view perspective in a first direction perpendicular to the multi-layer substrate, wherein the first row of power terminals, the first row of ground terminals, and the first row of switch terminals are aligned and extend along a second direction perpendicular to the first direction;
• and
• an output line laid on the multi-layer substrate, wherein the ground line, the switch line, and the output line are partially overlapped from a view perspective in a third direction perpendicular to the first direction and the second direction.