3D electromagnetic bandgap circuit
AssigneeRealtek Semiconductor Corp.
InventorsYu-Cong Wang, Ruey-Beei Wu, Shih-Hung Wang, Wen-Shan Wang
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AssigneeRealtek Semiconductor Corp.
InventorsYu-Cong Wang, Ruey-Beei Wu, Shih-Hung Wang, Wen-Shan Wang
Estimating the term…
A 3D electromagnetic bandgap circuit includes: a dielectric layer having a first surface and an opposing second surface; a spiral element positioned on the first surface; a first surrounding element positioned on the first surface and surrounding the spiral element, but does not touch with the spiral element; a plane element positioned on the second surface and including a notch; a second surrounding element positioned on the second surface and surrounding the plane element, but does not touch with the plane element, wherein the second surrounding element further includes a protruding portion extending toward the notch; a first via passing through the dielectric layer, the spiral element, and the protruding portion; a second via passing through the dielectric layer, the plane element, and the first surrounding element; and a third via passing through the dielectric layer, the plane element, and the first surrounding element.
A 3D electromagnetic bandgap circuit (100), comprising:
Dependencies are inferred from the claim text.