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US 10,856,403 B2Granted
Power electronics module and a method of producing a power electronics module
AssigneeABB Schweiz AG
InventorsJorma Manninen, Mika Silvennoinen, Joni Pakarinen, Kjell Ingman
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Abstract
A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.
Claims16
A power electronics module comprising
- multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and
- a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure comprises a compressible base plate,
- wherein the compressible base plate comprises heat transferring additives, including synthetic or natural diamond particles, alumina particles, graphene particles, silver particles and/or lead particles.
A method of producing a power electronics module comprising
- providing multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and
- attaching a heat transfer structure to the substrate, the heat transfer structure having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure comprises a compressible base plate,
- wherein the compressible base plate comprises heat transferring additives, including synthetic or natural diamond particles, alumina particles, graphene particles, silver particles and/or lead particles.
Dependencies are inferred from the claim text.