Self regulating flexible heating device

A flexible heating device, the device comprising:

• a flexible dielectric layer including at least one aperture;
• a first conductive layer formed using a first conductive ink disposed on a first surface of the flexible dielectric layer, the first conductive layer forming a positive bus bar and a negative bus bar;
• a first via layer mechanically coupled to an interior aperture wall by applying a first vacuum to draw the first conductive ink into the aperture;
• a second conductive layer formed using depositing a second conductive ink disposed on a second surface of the dielectric layer;
• a second via layer mechanically and conductively coupled to the first via layer by applying a second vacuum to draw the second conductive ink into the aperture and onto the first via layer to form a hollow via structure through the aperture, the hollow via structure to couple the first conductive layer with the second conductive layer;
• and
• a plurality of printed heating elements conductively coupled through the second conductive layer to the positive bus bar and to the negative bus bar.

At least one non-transitory machine-readable storage medium, comprising a plurality of instructions that, responsive to being executed with processor circuitry of a computer-controlled device, cause the computer-controlled device to perform operations comprising:

• form at least one aperture through a flexible dielectric layer;
• deposit a first conductive ink on a first surface of the flexible dielectric layer to form a first conductive layer, the first conductive layer including a positive bus bar and a negative bus bar;
• apply a first vacuum to draw the first conductive ink into the aperture to mechanically couple the first conductive ink to an interior aperture wall;
• deposit a second conductive ink on a second surface of the dielectric layer to form a second conductive layer;
• conductively couple the first conductive layer and the second conductive layer through the aperture by applying a second vacuum to draw the second conductive ink through the aperture to mechanically and conductively couple the second conductive ink to the first conductive ink on the interior aperture wall to form a conductive via structure;
• deposit a plurality of printed heating elements on the second surface of the dielectric layer;
• and
• conductively couple the plurality of printed heating elements through the second conductive layer to the positive bus bar and to the negative bus bar.