Efficient signaling scheme for high-speed ultra short reach interfaces
AssigneeMarvell Asia Pte Ltd
InventorsRamin Farjadrad, Paul Langner
Life of this patent
Estimating the term…
Abstract
A packaged semiconductor device includes a substrate and first, second, and third integrated circuit (IC) chips. The first integrated circuit (IC) chip is mounted on the substrate to receive first data and includes a first transfer interface to transmit the first data via first conductors formed in the substrate. The second IC chip mounts on the substrate and has a second transfer interface to receive the first data. The second IC includes on-chip conductors to route the first data on-chip to an output interface. The output interface transmits the first data via second conductors formed on the substrate. A third IC chip mounts on the substrate and has a third transfer interface to receive the first data via the second conductors.
Claims11
A packaged semiconductor device, comprising:
- a substrate;
- a first integrated circuit (IC) chip mounted on the substrate to receive first data and including a first transfer interface to transmit the first data via first conductors formed in the substrate;
- a second IC chip mounted on the substrate in a collinear planar arrangement with the first IC chip and having a second transfer interface to receive the first data, the second IC including on-chip conductors to route the first data on-chip to an output interface, the output interface to transmit the first data via second conductors formed on the substrate;
- a third IC chip mounted on the substrate in a collinear planar arrangement with the first IC chip and the second IC chip and having a third transfer interface to receive the first data via the second conductors;
- and
- wherein the second IC chip is disposed between the first IC chip and the third IC chip.
A method of operation in a multi-chip module (MCM), the method comprising:
- transmitting first data via a first output interface of a first integrated circuit (IC) chip along first conductors formed in the substrate;
- receiving the first data with a second transfer interface of a second IC chip mounted on the substrate in a collinear planar arrangement with the first IC chip;
- routing the first data on-chip to an output interface of the second IC chip;
- transmitting the first data via the output interface of the second IC chip along second conductors formed on the substrate;
- and
- receiving the first data with a third transfer interface of a third IC chip via the second conductors, the third IC chip mounted on the substrate in a collinear planar arrangement with the first IC chip and the second IC chip and disposed between the first IC chip and the second IC chip.
Dependencies are inferred from the claim text.