Electronic component and method of manufacturing the same

An electronic component comprising:

• a substrate;
• a device chip, in which a functional element is located on a lower surface thereof, that is mounted on an upper surface of the substrate so that the functional element and the upper surface of the substrate are opposite to each other via an air gap;
• a ring-shaped metal layer that is located on the upper surface of the substrate, surrounds the device chip in a plan view, and has a protruding part located along an outer periphery thereof, an outer side surface of the ring-shaped metal layer being higher than an inner side surface thereof;
• a metal sealer that surrounds the device chip in the plan view, and is bonded on an upper surface of the ring-shaped metal layer;
• and
• a metal film that is located on side surfaces of the metal sealer and the ring-shaped metal layer,
• wherein the metal sealer does not bond to an upper surface of the substrate inside the ring-shaped metal layer, an inside of the metal sealer includes the air gap, and the metal film, the protruding part and the metal sealer and the air gap overlap in a perpendicular direction to a side surface of the device chip.