Press-fit pin, semiconductor package having the same and method for manufacturing the press-fit pin

A press-fit pin comprising:

• a press unit press-fitted into a through hole formed on a board, wherein the press unit is pressurized toward a long hole formed inside the press unit, applies elastic forces to an inner surface of the through hole, and maintains a contact with the inner surface of the through hole;
• a first terminal which is extended for a predetermined length from one side of the press unit along a longitudinal direction of the press unit and is disposed at the upper side of the board when press fitting the press unit;
• and
• a second terminal which is extended for a predetermined length from the other side of the press unit along the longitudinal direction of the press unit and is disposed at the lower side of the board, when press fitting the press unit,
• wherein the press unit comprises first and second press-fit parts which face each other along a width direction of the press unit based on the long hole, each press-fit part being deformed in the width direction of the press unit and a thickness direction of the press unit, when press-fitted into the through hole, and applying elastic forces in the width direction and the thickness direction,
• wherein the first press-fit part is bent in the thickness direction to have a semicircular form having a predetermined radius of curvature and an outer side surface of the first press-fit part is curved in the width direction such that the first press-fit part is elastically deformed in the thickness and width directions when press-fitted into the through hole,
• wherein the second press-fit part is bent in the thickness direction to have a semicircular form having a predetermined radius of curvature and an outer side surface of the second press-fit part is curved in the width direction such that the second press-fit part is elastically deformed in the thickness and width directions when press-fitted into the through hole.