Antenna package structure and antenna packaging method

An antenna packaging method, comprising steps:

• 1) providing a first support substrate, and forming a separation layer on the first support substrate;
• 2) forming a first rewiring layer on the separation layer, wherein the first rewiring layer comprises a first surface connected to the separation layer and a second surface opposite to the first surface;
• 3) providing an antenna structure, wherein the antenna structure comprises:
• a first antenna metal layer;
• a first packaging layer disposed on the first antenna metal layer, wherein the first packaging layer is polished on a top surface;
• a second rewiring layer, disposed on the polished surface of the first packaging layer;
• and
• a first metal bump, formed on the second rewiring layer;
• 4) bonding the second surface of the first rewiring layer to the first metal bump to attach the antenna structure to the first rewiring layer;
• 5) forming a second metal connecting column on the second surface of the first rewiring layer;
• 6) depositing a second packaging layer over the antenna structure and the second metal connecting column, performing planarization treatment on a top surface of the second packaging layer, to expose a top surface of the second metal connecting column from the second packaging layer, wherein the top surface of the second metal connecting column is not lower than a top surface of the antenna structure;
• 7) forming a second antenna metal layer on a top surface of the second packaging layer, wherein the second antenna metal layer is connected to the second metal connecting column;
• 8) stripping off the separation layer from the first surface of the first rewiring layer and removing the first support substrate, to expose the first surface of the first rewiring layer;
• 9) providing an antenna circuit chip with at least two output ports, bonding the antenna circuit chip to the first surface of the first rewiring layer and aligning the two output ports to a first metal layer of the first rewiring layer;
• and
• 10) forming a second metal bump at the first surface of the first rewiring layer, to achieve electrical lead-out of the first rewiring layer.