Heat dissipation structure for electronic device including antenna module

An electronic device, comprising:

• a frame surrounding at least a portion of a component exposed to an outer surface of the electronic device and forming a part of the outer surface of the electronic device;
• a heat dissipation sheet thermally connected to a battery of the electronic device;
• a first heat dissipation member disposed to partially overlap the frame, extended toward an antenna module of the electronic device, and thermally connected to the heat dissipation sheet;
• and
• a heat insulation member interposed between the frame and the first heat dissipation member.

A heat dissipation structure, comprising:

• a frame surrounding at least a portion of a component exposed to an outer surface of an electronic device and forming a part of the outer surface of the electronic device;
• a first heat dissipation member disposed to partially overlap the frame, and extended, at one end thereof, toward an antenna module of the electronic device;
• a second heat dissipation member thermally connecting the antenna module and the first heat dissipation member;
• and
• a heat insulation member interposed between the frame and the first heat dissipation member.