Method for manufacturing semiconductor device

A method for manufacturing a semiconductor device, the method comprising:

• forming a metal layer on a substrate, the metal layer comprising a first metal and a second metal
• after forming the metal layer on the substrate, removing the second metal in a portion of the metal layer, thereby forming on the substrate:
• a first metal portion formed from the first metal, the first metal portion comprising a plurality of pores, and
• a second metal portion formed from the first metal and the second metal,
• wherein a thickness of the first metal portion is greater than a thickness of the second metal portion;
• preparing a structure body comprising a semiconductor stacked body, wherein a first surface of the structure body comprises a concave portion;
• and
• bonding the first metal portion to the structure body, such that:
• a first part of the first metal portion is bonded to the concave portion of the first surface, and a second part of the first metal portion is bonded to a part of the first surface other than the concave portion;
• the first metal portion is bonded to the first surface such that at least a portion of the concave portion is filled with the first metal portion, and
• an average diameter of a plurality of the pores in the second part of the first metal portion is smaller than an average diameter of a plurality of the pores in the first part of the first metal portion.

A method for manufacturing a semiconductor device, the method comprising:

• forming a first metal portion on a substrate, the first metal portion comprising a plurality of pores;
• preparing a structure body comprising a semiconductor stacked body, wherein a first surface of the structure body comprises a concave portion;
• and
• bonding the first metal portion to the structure body, such that:
• a first part of the first metal portion is bonded to the concave portion of the first surface, and a second part of the first metal portion is bonded to a part of the first surface other than the concave portion,
• the first metal portion is bonded to the first surface such that a portion of the concave portion is filled with the first metal portion, and a space is formed and surrounded by the first surface and the first metal portion at the concave portion, and
• an average diameter of a plurality of the pores in the second part of the first metal portion is smaller than an average diameter of a plurality of the pores in the first part of the first metal portion.