Bonding strategies for placement of LEDs from multiple carrier substrates

A non-transitory computer readable storage medium storing processor executable instructions, the instructions comprising instructions for:

• moving, towards a target substrate, a first carrier substrate mounted with a first array of LEDs having first contacts;
• bonding the first contacts of the first array of LEDs directly onto a first subset of contact protrusions on the target substrate responsive to moving the first carrier substrate, the first subset of contact protrusions being matched with the first array of LEDs;
• moving, towards the target substrate, a second carrier substrate mounted with a second array of LEDs having second contacts after bonding the first contacts onto the first subset of contact protrusions;
• and
• bonding the second contacts of the second array of LEDs directly onto a second subset of contact protrusions on the target substrate responsive to moving the second substrate, the second subset of contact protrusions being matched with the second array of LEDs but mismatched with the first array of LEDs;
• wherein a first height of the first contacts before bonding to the first subset of contact protrusions is different from a second height of the second contacts before bonding to the second subset of contact protrusions;
• wherein a third height of the first subset of contact protrusions is different from a fourth height of the second subset of contact protrusions;
• and
• wherein a first sum of the first height and the third height is substantially equal to a second sum of the second height and the fourth height.