Photon extraction from ultraviolet light-emitting devices
AssigneeCrystalis, Inc.
InventorsKen Kitamura, Masato Toita, Hironori Ishii, Yuting Wang, Leo J. Schowalter, Jianfeng Chen, James R. Grandusky
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Abstract
In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
Claims28
An illumination device comprising:
- an ultraviolet (UV) light-emitting semiconductor die;
- and
- a layer of non-stoichiometric silica material disposed over and/or around the semiconductor die,
- wherein the non-stoichiometric silica material comprises silicon, oxygen, and carbon, a carbon content of the non-stoichiometric silica material being greater than 1 ppm and less than 40 atomic percent.
An illumination device comprising:
- an ultraviolet (UV) light-emitting semiconductor die;
- and
- a layer of encapsulant disposed over and/or around the semiconductor die,
- wherein (i) a first portion of the layer of encapsulant comprises a non-stoichiometric silica material, (ii) a second portion of the layer of encapsulant comprises silicone, and (iii) the non-stoichiometric silica material comprises silicon, oxygen, and carbon, a carbon content of the non-stoichiometric silica material being greater than 1 ppm and less than 40 atomic percent.
Dependencies are inferred from the claim text.