US 10,854,788 B2 · Method for producing an optoelectronic component and optoelectronic component

Abstract

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a method includes attaching a plurality of optoelectronic semiconductor chips on predetermined locations of an intermediate film, providing a cavity film with a plurality of separated openings, attaching the cavity film to the intermediate film such that each optoelectronic semiconductor chip is associated with a respective opening, wherein the cavity film is thicker than the optoelectronic semiconductor chips such that the cavity film exceeds the optoelectronic semiconductor chips in a direction away from the intermediate film, filling a casting material in each of the openings such that the optoelectronic semiconductor chips are casted with the casting material and removing the intermediate film.

Claims18

Dependent claims

A method for producing an optoelectronic component, the method comprising:

attaching a plurality of optoelectronic semiconductor chips on locations of an intermediate film;
providing a cavity film with a plurality of separated openings;
attaching the cavity film to the intermediate film such that each optoelectronic semiconductor chip is associated with a respective opening, wherein the cavity film is thicker than the optoelectronic semiconductor chips such that the cavity film exceeds the optoelectronic semiconductor chips in a direction away from the intermediate film;
filling a casting material in each of the openings such that the optoelectronic semiconductor chips are casted with the casting material;
and
removing the intermediate film.

3 more elements

An optoelectronic component comprising:

an optoelectronic semiconductor chip with a top side, a bottom side opposite the top side, and a side surface connecting the top side and the bottom side;
a phosphor layer configured to convert radiation emitted from the optoelectronic semiconductor chip;
and
a housing body with an opening, the opening completely penetrating through the housing body,
wherein the optoelectronic semiconductor chip is located inside the opening,
wherein the bottom side of the optoelectronic semiconductor chip forms a part of a bottom side of the optoelectronic component,
wherein the housing body exceeds the optoelectronic semiconductor chip at its top side,
wherein the housing body completely surrounds the optoelectronic semiconductor chip in a lateral direction,
wherein the opening is bound by an inner side surface of the housing body in the lateral direction,
wherein the inner side surface of the housing body faces the side surface of the optoelectronic semiconductor chip,
wherein the housing body is made of a plastic material,
wherein a side surface of the optoelectronic component is at least partially formed by an outer side surface of the housing body and shows traces of material removal,
wherein a first part of the phosphor layer covers the top side of the optoelectronic semiconductor chip, wherein a second part of the phosphor layer covers the side surface of the optoelectronic semiconductor chip, wherein a third part of the phosphor layer covers the inner side surface of the housing body, and wherein a gap separates the second part and the third part of the phosphor layer from each other in the lateral direction.

10 more elements

Dependencies are inferred from the claim text.

Method for producing an optoelectronic component and optoelectronic component

Life of this patent

Method for producing an optoelectronic component and optoelectronic component

Life of this patent

Abstract

Claims18