Optoelectronic arrangement and method for producing an optoelectronic arrangement

Optoelectronic arrangement comprising:

• a moulded body embodied as a carrier and having a top surface and a bottom surface facing away from the top surface,
• a first pixel group, to which a multiplicity of pixels are assigned, wherein each pixel has a first semiconductor region, a second semiconductor region and an active region that emits and/or absorbs electromagnetic radiation during the operation of the arrangement, a multiplicity of separating structures arranged between the pixels, and
• a first contact structure having a first contact plane and a first contact location, which is freely accessible at the bottom surface, wherein:
• the pixels of the first pixel group are arranged alongside one another at the top surface,
• the first semiconductor regions and/or the second semiconductor regions of adjacent pixels of the first pixel group are spatially separated from one another by means of the separating structures,
• the first semiconductor regions and the active regions of adjacent pixels are completely spatially separated from one another by the separating structures,
• the second semiconductor regions of adjacent pixels are connected to one another via intermediate regions formed with the material of the second semiconductor regions,
• the first contact structure is assigned one-to-one to the first pixel group, and
• the first semiconductor regions of the pixels of the first pixel group are electrically conductively connected to one another by means of the first contact plane and are electrically contactable by means of the first contact location,
• the separating structures are formed by trenches that are free of a material of the pixels, and
• the moulded body comprises portions arranged within the trenches.

Optoelectronic arrangement comprising:

• a moulded body embodied as a carrier and having a top surface and a bottom surface facing away from the top surface,
• a first pixel group, to which a multiplicity of pixels are assigned, wherein each pixel has a first semiconductor region, a second semiconductor region and an active region that emits and/or absorbs electromagnetic radiation during the operation of the arrangement,
• a multiplicity of separating structures arranged between the pixels, and
• a first contact structure having a first contact plane and a first contact location, which is freely accessible at the bottom surface, wherein:
• the pixels of the first pixel group are arranged alongside one another at the top surface,
• the first semiconductor regions and/or the second semiconductor regions of adjacent pixels of the first pixel group are spatially separated from one another by means of the separating structures,
• the first contact structure is assigned one-to-one to the first pixel group,
• the first semiconductor regions of the pixels of the first pixel group are electrically conductively connected to one another by means of the first contact plane and are electrically contactable by means of the first contact location,
• each pixel is individually drivable,
• the separating structures are formed by trenches that are free of a material of the pixels, and
• the moulded body comprises portions arranged within the trenches.