Micro-LED transfer method and manufacturing method
AssigneeGoertek Inc.
InventorQuanbo Zou
Life of this patent
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Abstract
Disclosed a micro-LED transfer method and manufacturing method. The micro-LED transfer method comprises: bringing pickup units (305, 605, 705) of a transfer head in contact with micro-LEDs (303, 603, 703) on a carrier substrate (301, 601, 701), wherein the pickup units (305, 605, 705) are able to apply current to the micro-LEDs (303, 603, 703); applying current to the micro-LEDs (303, 603, 703) via the pickup units (305, 605, 705) to obtain I-V characteristics of the micro-LEDs (303, 603, 703); determining known-good-die micro-LEDs based on the I-V characteristics; and transferring the known-good-die micro-LEDs from the carrier substrate to a receiving substrate (307, 608, 708) by using the transfer head.
Claims10
A micro-LED transfer method, comprising:
- bringing pickup units of a transfer head in contact with micro-LEDs on a carrier substrate, wherein the pickup units are able to apply current to the micro-LEDs;
- applying current to the micro-LEDs via the pickup units to obtain I-V characteristics of the micro-LEDs;
- determining known-good-die micro-LEDs based on the I-V characteristics;
- and
- transferring the known-good-die micro-LEDs from the carrier substrate to a receiving substrate by using the transfer head.
Dependencies are inferred from the claim text.