Method and device for transferring electronic components between substrates

A method of transferring electronic components from a carrier substrate to a receiving substrate, wherein the method comprises:

• a positioning step in which a first carrier substrate, on which a plurality of electronic components is arranged in a grid and each electronic component is adhered at a corresponding adhesion site by means of an adhesion releasable by laser radiation, is positioned relative to the receiving substrate;
• a first transfer step in which, while the relative positioning of the first carrier substrate to the receiving substrate is maintained, the adhesion sites of the electronic components of a first transfer unit consisting of at least two of the electronic components arranged on the first carrier substrate are selectively irradiated with laser radiation in such a way that the adhesion of the electronic components of the first transfer unit is thereby selectively released from the first carrier substrate at the adhesion sites and the electronic components of the first transfer unit are each respectively transferred to a grid position on the receiving substrate which corresponds to the electronic components' initial arrangement in the grid on the first carrier substrate, wherein an intermediate carrier substrate with an alignment device is used as the receiving substrate, the intermediate carrier substrate comprises a belt which is configured to continuously move along a direction of movement and onto which electronic components from the first carrier substrate are transferred by means of a fixed detachment rate during the first transfer step;
• and
• an alignment step in which the electronic components which have been transferred to the intermediate carrier substrate by means of the first transfer step are spatially aligned by means of the alignment device thereof.