Electronic switch and active artificial dielectric

A method for fabricating a switching device comprising:

• providing a first substrate having a conducting layer;
• creating one or more dielectric breakdown switching layers on the conducting layer, each dielectric breakdown switching layer comprising a first dielectric layer and one or more second dielectric layers, and one or more conducting elements comprising at least one conductive plate disposed on or within each second dielectric layer, and a conductive via connected to the at least one conductive plate and extending through the second dielectric layer and toward the conducting layer but spaced apart from the conducting layer;
• creating an opening in the first dielectric layer proximate to the conductive via that forms a gap between the conducting layer and the conductive via within the second dielectric layer, wherein the gap extends directly between a tip of the conductive via and the conducting layer;
• and
• creating a second substrate on the second dielectric layer.