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US 10,854,702 B2Granted
Array substrate and display device
AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorsYan Xie, Jianhong Lin
Life of this patent
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Abstract
An array substrate and a display device are provided. The array substrate includes a plurality of first through holes, and a substrate, a first metal layer, an interlayer dielectric layer, and a second metal layer are formed in sequence. The first through holes are defined in the interlayer dielectric layer. The second metal layer is connected to the first metal layer through the first through holes.
Claims14
An array substrate, comprising:
- a plurality of first through holes and a substrate, a first metal layer, an interlayer dielectric layer and a second metal layer formed in sequence;
- wherein the first through holes are defined in the interlayer dielectric layer;
- and
- the second metal layer is connected to first scanning lines formed in the first metal layer through the first through holes, and the first scanning lines are made of molybdenum;
- wherein the array substrate further comprises a plurality of second through holes, a first insulating layer, a second insulating layer, and a third metal layer;
- the first insulating layer is formed on the substrate;
- the first metal layer is formed on the first insulating layer;
- the second insulating layer is formed on the first metal layer and the first insulating layer;
- the third metal layer is formed on the second insulating layer;
- the interlayer dielectric layer is formed on the third metal layer and the second insulating layer;
- and
- the first through holes are defined in the interlayer dielectric layer and the second insulating layer, the second through holes are defined in the interlayer dielectric layer, and the second metal layer is connected to the third metal layer through the second through holes;
- wherein the interlayer dielectric layer comprises an inorganic insulating layer and an organic filling layer;
- the inorganic insulating layer is formed on the third metal layer and the second insulating layer;
- and
- the organic filling layer is formed on the inorganic insulating layer.
13 more elements
An array substrate, comprising:
- a plurality of first through holes and a substrate, a first metal layer, an interlayer dielectric layer and a second metal layer formed in sequence;
- wherein the first through holes are defined in the interlayer dielectric layer;
- and
- the second metal layer is connected to the first metal layer through the first through holes;
- wherein the array substrate further comprises:
- a plurality of second through holes, a first insulating layer, a second insulating layer, and a third metal layer;
- the first insulating layer is formed on the substrate;
- the first metal layer is formed on the first insulating layer;
- the second insulating layer is formed on the first metal layer and the first insulating layer;
- the third metal layer is formed on the second insulating layer;
- the interlayer dielectric layer is formed on the third metal layer and the second insulating layer;
- and
- the first through holes are defined in the interlayer dielectric layer and the second insulating layer, the second through holes are defined in the interlayer dielectric layer, and the second metal layer is connected to the third metal layer through the second through holes;
- wherein the interlayer dielectric layer comprises an inorganic insulating layer and an organic filling layer;
- the inorganic insulating layer is formed on the third metal layer and the second insulating layer;
- and
- the organic filling layer is formed on the inorganic insulating layer.
14 more elements
A display device, comprising an array substrate;
- wherein the array substrate comprises a plurality of first through holes and a substrate, a first metal layer, an interlayer dielectric layer and a second metal layer formed in sequence;
- the first through holes are defined in the interlayer dielectric layer;
- and
- the second metal layer is connected to the first metal layer through the first through holes;
- wherein the array substrate further comprises:
- a plurality of second through holes, a first insulating layer, a second insulating layer, and a third metal layer;
- the first insulating layer is formed on the substrate;
- the first metal layer is formed on the first insulating layer;
- the second insulating layer is formed on the first metal layer and the first insulating layer;
- the third metal layer is formed on the second insulating layer;
- the interlayer dielectric layer is formed on the third metal layer and the second insulating layer;
- and
- the first through holes are defined in the interlayer dielectric layer and the second insulating layer, the second through holes are defined in the interlayer dielectric layer, and the second metal layer is connected to the third metal layer through the second through holes;
- wherein the interlayer dielectric layer comprises an inorganic insulating layer and an organic filling layer;
- the inorganic insulating layer is formed on the third metal layer and the second insulating layer;
- and
- the organic filling layer is formed on the inorganic insulating layer.
14 more elements
Dependencies are inferred from the claim text.