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US 10,854,667 B2Granted
Solid-state imaging device, manufacturing method of solid-state imaging element, and imaging apparatus
AssigneeSony Corporation
InventorHiroyasu Matsugai
Life of this patent
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Abstract
There is provided solid-state imaging devices and methods of forming the same, the solid-state imaging devices including: a semiconductor substrate; a glass substrate; an adhesion layer provided between the semiconductor substrate and the glass substrate; and a warpage correction film provided adjacent to one of the semiconductor substrate and the glass substrate.
Claims20
A package, comprising:
- a first substrate including a plurality of photoelectric conversion elements;
- a glass substrate;
- an adhesion layer between the first substrate and the glass substrate;
- a warpage correction film between the adhesion layer and the first substrate;
- and
- a transparent resin layer between the first substrate and the warpage correction film, wherein a refractive index of the warpage correction film is between a refractive index of the transparent resin layer and a refractive index of the adhesion layer.
3 more elements
Dependencies are inferred from the claim text.