Solid-state image pickup element and electronic apparatus

An electronic apparatus comprising:

• a solid-state image pickup element;
• and
• a signal processing portion for processing a signal output from the solid-state image pickup element,
• the solid-state image pickup element including a pixel substrate including
• a light condensing layer for condensing incident light on a photoelectric conversion element,
• a semiconductor layer in which the photoelectric conversion element is formed, and
• a wiring layer in which a wiring and a pad for outside connection are laminated on one another, wherein at least a part of a first surface of the pad is exposed through a through hole completely extending through the light condensing layer and the semiconductor layer,
• wherein the wiring of the wiring layer is connected to a side surface of the pad.

A light detecting device comprising:

• a pixel substrate including a light condensing layer, a first semiconductor layer including a plurality of photoelectric conversion elements, and a first wiring layer including a pad for external connection, a wiring, and a first plurality of electrically conductive components;
• and
• a control substrate including a second semiconductor layer including a control circuit and a second wiring layer including a second plurality of electrically conductive components;
• wherein the pixel substrate and the control substrate are bonded such that the first wiring layer and the second wiring layer face each other,
• wherein a first electrically conductive component of the first plurality of electrically conductive components and a second electrically conductive component of the second plurality of electrically conductive components are bonded to each other,
• wherein at least a part of a first surface of the pad is exposed through a hole extending through the light condensing layer and the first semiconductor layer, and
• wherein a second surface opposite to the first surface of the pad is connected to at least one of the first plurality of electrically conductive components through the wiring of the first wiring layer.