Wafer level packaging of light emitting diodes (LEDs)

A lighting device comprising:

• a crystalline substrate comprising an inner face, an outer face opposing the inner face, and a thickness, wherein the crystalline substrate comprises one of silicon carbide or sapphire;
• an array of LEDs supported by the crystalline substrate proximate to the inner face, wherein the array of LEDs comprises a plurality of anode contacts and a plurality of cathode contacts in conductive electrical communication with the array of LEDs, and the array of LEDs is arranged to transmit LED emissions through the crystalline substrate to exit the outer face;
• and
• a carrier comprising a plurality of anode pads in conductive electrical communication with the plurality of anode contacts, and comprising a plurality of cathode pads in conductive electrical communication with the plurality of cathode contacts;
• wherein the array of LEDs is arranged between the crystalline substrate and the carrier;
• wherein a plurality of features is defined in the silicon carbide or sapphire of the crystalline substrate, the plurality of features comprises a plurality of recesses formed in the crystalline substrate, with each recess of the plurality of recesses extending from the outer face in a direction toward the inner face, and the crystalline substrate being continuous between different LEDs of the array of LEDs;
• and
• wherein individual features of the plurality of features are registered with boundaries between different LEDs of the array of LEDs.