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US 10,854,579 B2Granted
Semiconductor package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Cheng Hsu, Shin-Puu Jeng
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Abstract
The present disclosure provides a semiconductor package, including a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die connected to the first surface of the substrate, and a conductive bump connected to the conductive via at the second surface. The substrate includes a conductive line surrounded by a dielectric and a conductive via connected to the conductive line and penetrating the dielectric at the second surface.
Claims20
A semiconductor package, comprising:
- a substrate having a first surface and a second surface opposite to the first surface, the substrate comprising:
- a conductive line surrounded by a dielectric;
- and
- a conductive via connected to the conductive line and penetrating the dielectric at the second surface;
- a semiconductor die connected to the first surface of the substrate;
- a conductive bump connected to the conductive via at the second surface;
- and
- a seed layer between the conductive via and the conductive bump.
5 more elements
A semiconductor package, comprising:
- a redistribution layer (RDL) substrate having a first surface and a second surface opposite to the first surface, a first RDL at the second surface comprising a conductive surface exposed from a dielectric of the RDL substrate;
- a semiconductor die connected to a second RDL at the first surface, and
- a copper pillar connected to the conductive surface.
A semiconductor package, comprising:
- a redistribution layer (RDL) substrate having a first surface and a second surface opposite to the first surface;
- a semiconductor die bonded to the first surface;
- a conductive pattern layer on the second surface;
- and
- a seed layer between the second surface and the conductive pattern layer;
- wherein the conductive pattern layer comprises a copper pillar and a copper pad, the copper pillar being thicker than the copper pad.
3 more elements
Dependencies are inferred from the claim text.