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US 10,854,572 B2Granted
Method for manufacturing anisotropic conductive adhesive including gapper and method for mounting component using gapper
AssigneeNopion.Co.Ltd
InventorKyung Sub Lee
Life of this patent
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Abstract
Provided relates to a method for manufacturing an anisotropic conductive adhesive and a method for mounting a component using an anisotropic conductive adhesive, and provides a method for manufacturing an anisotropic conductive adhesive, including: a process of removing a first oxide film on solder particles by using a first reducing agent; and a process of manufacturing an anisotropic conductive adhesive by mixing the solder particles, a gapper, and an adhesive resin.
Claims12
A method for manufacturing an anisotropic conductive adhesive including a gapper, the method comprising:
- removing a first oxide film on solder particles by using a first reducing agent;
- adding the solder particles, from which the first oxide film has been removed, into a solvent;
- forming a second oxide film, whose oxygen concentration is lower than that of the first oxide film, on the added solder particles;
- and
- manufacturing the anisotropic conductive adhesive by mixing the solder particles with the second oxide film formed thereon, the gapper, and an adhesive resin.
2 more elements
Dependencies are inferred from the claim text.