Semiconductor device and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang
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Abstract
A semiconductor device includes a substrate includes a first layer and a second layer over the first layer, a bump disposed over the second layer, a molding disposed over the second layer and surrounding the bump, and a retainer disposed over the second layer, wherein the retainer is disposed between the molding and a periphery of the substrate. Further, a method of manufacturing a semiconductor device includes providing a substrate, disposing several bumps on the substrate, disposing a retainer on the substrate and surrounding the bumps, and disposing a molding between the bumps and the retainer.
Claims20
A method of manufacturing a semiconductor device, comprising:
- providing a substrate including a first layer and a second layer over the first layer;
- disposing a plurality of bumps on the second layer;
- disposing a retainer on the second layer and surrounding the plurality of bumps, including:
- performing a photolithographic process to form a plurality of blocking rings closed around the plurality of bumps respectively;
- disposing a molding on the second layer, wherein the molding is disposed between the bumps and the retainer, and the molding is in contact with at least a portion of the bump;
- and
- cutting the substrate into a plurality of dies.
A method of manufacturing a semiconductor device, comprising:
- providing a semiconductor wafer with contact pads;
- forming a passivation layer on the semiconductor wafer;
- forming a polymer layer on the passivation layer;
- forming a post passivation interconnect on the polymer layer;
- disposing a bump on the post passivation interconnect;
- forming a retainer on the polymer layer, including:
- performing a photolithographic process to form a blocking ring closed around the of bump;
- disposing a molding material between the bump and the retainer;
- and
- cutting the substrate into a plurality of dies.
A method of manufacturing a semiconductor device, comprising:
- providing a semiconductor substrate;
- disposing a plurality of bumps on the semiconductor substrate;
- disposing a retainer on the semiconductor substrate and surrounding the plurality of bumps, including:
- performing a photolithographic process to form a plurality of blocking rings closed around the plurality of bumps respectively;
- using a stencil mask to screen print a liquid molding material on the semiconductor substrate between the bumps and the retainer, and the molding is in contact with at least a portion of the bump;
- and
- cutting the substrate into a plurality of dies.
Dependencies are inferred from the claim text.