Device, semiconductor package and method of manufacturing semiconductor package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng
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Abstract
A redistribution structure includes a first dielectric layer, a pad pattern, and a second dielectric layer. The pad pattern is disposed on the first dielectric layer and includes a pad portion and a peripheral portion. The pad portion is embedded in the first dielectric layer, wherein a lower surface of the pad portion is substantially coplanar with a lower surface of the first dielectric layer. The peripheral portion surrounds the pad portion. The second dielectric layer is disposed on the pad pattern and includes a plurality of extending portions extending through the peripheral portion.
Claims20
A method, comprising:
- forming a first dielectric layer on a carrier, wherein the first dielectric layer comprises at least one pad opening;
- forming a pad pattern on the first dielectric layer, wherein the pad pattern extends into the at least one pad opening and comprises a plurality of holes distributed at a peripheral portion of the pad pattern, and a lower surface of the pad pattern is substantially coplanar with a lower surface of the first dielectric layer;
- forming a second dielectric layer on the pad pattern, wherein the holes of the pad pattern are filled by extending portions of the second dielectric layer;
- and
- removing the carrier to reveal the lower surface of the pad pattern.
A method, comprising:
- forming a redistribution structure, wherein forming the redistribution structure comprises:
- forming a first dielectric layer;
- forming a pad pattern comprising a pad portion embedded in the first dielectric layer and a peripheral portion surrounding the pad portion, wherein a lower surface of the pad portion is substantially coplanar with a lower surface of the first dielectric layer;
- and
- forming a plurality of dielectric plugs extending through the peripheral portion and surrounding the pad portion;
- and
- forming a connector bump on the lower surface of the pad portion.
A method of manufacturing a semiconductor package, comprising:
- forming a redistribution structure on a carrier, wherein forming the redistribution structure on the carrier comprises:
- forming a first dielectric layer on the carrier, wherein the first dielectric layer comprises a pad opening;
- forming a pad pattern on the first dielectric layer, wherein the pad pattern extends into the pad opening and comprises a plurality of holes surrounding the pad opening;
- and
- forming a second dielectric layer on the pad pattern, wherein the second dielectric layer fills the plurality of holes;
- forming an encapsulated semiconductor device on the redistribution structure;
- and
- removing the carrier to reveal a lower surface of the pad pattern.
Dependencies are inferred from the claim text.