Semiconductor device

A semiconductor device comprising:

• a semiconductor substrate including:
• a chip region;
• and
• an edge region provided on an outer side of the chip region;
• a semiconductor integrated circuit disposed in the chip region of the semiconductor substrate;
• first metal patterns and first metal vias electrically connected to the semiconductor integrated circuit on the chip region of the semiconductor substrate;
• a plurality of connection structures provided on the edge region, the plurality of connection structures being spaced apart from one another by a first distance in a first direction in a plan view;
• a lower insulating layer disposed on the semiconductor substrate, the first metal patterns, the first metal vias, and the plurality of connection structures being disposed in the lower insulating layer;
• an upper insulating layer disposed on the lower insulating layer;
• and
• a plurality of redistribution pads disposed on the upper insulating layer,
• wherein each of the redistribution pads includes:
• a via portion disposed on the edge region, the via portion extending through the upper insulating layer to be connected to one of the connection structures;
• and
• a pad portion disposed on the chip region, the pad portion having a width greater than a width of the via portion, the width being measured in a second direction intersecting the first direction in the plan view, and
• wherein the pad portions of the redistribution pads are spaced apart from the connection structures in the second direction in the plan view.