Methods and modules related to shielded lead frame packages
AssigneeSkyworks Solutions, Inc.
InventorHoward E. Chen
Life of this patent
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Abstract
Devices and methods are disclosed, related to shielding and packaging of radio-frequency (RF) devices on substrates. In some embodiments, a method for providing electro-magnetic interference shielding for a radio-frequency module can include applying a metal-based covering over a portion of a lead-frame package, the package having a plurality of pins with at least one pin exposed from overmold compound and in contact with the metal-based covering. The method can also include mounting the lead-frame package on a substrate. The method can further include connecting the metal-based covering to a ground plane of the substrate.
Claims20
A method for providing electro-magnetic interference shielding for a radio-frequency module, the method comprising:
- applying a metal-based covering over a portion of a lead-frame package, the lead-frame package having a plurality of pins with at least one pin exposed from overmold compound and in contact with the metal-based covering, the applying the metal-based covering including spraying metallic paint on the lead-frame package;
- mounting the lead-frame package on a substrate;
- and
- connecting the metal-based covering to a ground plane of the substrate.
A method for providing electro-magnetic interference shielding for a radio-frequency module, the method comprising:
- applying a metal-based covering over a portion of a lead-frame package, the lead-frame package having a plurality of pins with at least one pin exposed from overmold compound and in contact with the metal-based covering;
- mounting the lead-frame package on a substrate;
- connecting the metal-based covering to a ground plane of the substrate;
- and
- removing metal buildup of the metal-based covering from at least one section of one side of the lead-frame package.
A method for providing electro-magnetic interference shielding for a radio-frequency module, the method comprising:
- applying a metal-based covering over a portion of a lead-frame package, the lead-frame package having a plurality of pins with at least one pin exposed from overmold compound and in contact with the metal-based covering, the lead-frame package being a dual-row, quadrature, flat no-lead (QFN) chip package;
- mounting the lead-frame package on a substrate;
- and
- connecting the metal-based covering to a ground plane of the substrate.
Dependencies are inferred from the claim text.