Semiconductor device packaging with metallic shielding layer

A semiconductor device, comprising:

• an island that is formed by a metallic layer including a single metallic layer or a plurality of different metallic layers;
• a semiconductor chip provided upon an upper surface of the island, and having a pair of side portions mutually opposing each other;
• a plurality of signal terminals disposed at an external periphery of at least the pair of side portions of the semiconductor chip, and formed by the metallic layer;
• a grounding terminal disposed at an external periphery of the plurality of signal terminals, and formed by the metallic layer;
• electrically conductive connection members that are connected between each of a plurality of electrodes of the semiconductor chip and each of the plurality of signal terminals;
• sealing resin that seals the island, the semiconductor chip, the electrically conductive connection members, the plurality of signal terminals, and the grounding terminal, so that a lower surface of the island, lower surfaces of the plurality of signal terminals, and a lower surface of the grounding terminal are exposed to the exterior;
• and
• a metallic shielding layer that covers over an outer peripheral side surface and an upper surface of the sealing resin, and a portion of the grounding terminal, wherein:
• the grounding terminal is formed with a step, and has an inner peripheral portion and an outer peripheral portion that is thinner than the inner peripheral portion;
• and
• the metallic shielding layer is joined to an outer peripheral side surface of the step portion at a boundary between the inner peripheral portion and the outer peripheral portion.