Semiconductor package device and method of manufacturing the same

A method of manufacturing a semiconductor package device, comprising:

• providing a substrate comprising a grounding element;
• disposing a die on a top surface of the substrate;
• forming a package body on the top surface of the substrate to cover the die;
• forming an interconnection element on a bottom surface of the substrate;
• disposing a first insulating film on the bottom surface of the substrate, wherein the first insulating film covers a first portion of the interconnection element and exposes a second portion of the interconnection element to an outside of the semiconductor package device;
• forming a second insulating film on the first insulating film and the second portion of the interconnection element, wherein the second insulating film is conformal to the interconnection element;
• forming a shielding layer on an external surface of the package body and a lateral surface of the substrate, wherein the shielding layer is connected to the grounding element;
• and
• removing the second insulating film.