Semiconductor package structure and a method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsShun-Tsat Tu, Chunku Kuo, Ya-Tian Hou, Tsung-Chieh Kuo
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Abstract
A semiconductor package structure includes a substrate having a patterned surface, the patterned surface including a first region and a second region, wherein a first line width in the first region is smaller than a second line width in the second region. The semiconductor package structure further includes a first die hybrid-bonded to the first region through conductive features adapted for the first line width, and a second die bonded to the second region through conductive features adapted for the second line width. The manufacturing operations of the semiconductor package structure are also disclosed.
Claims20
A semiconductor package structure, comprising:
- a substrate having a patterned surface, the patterned surface comprising a first region and a second region, wherein a first line width in the first region is smaller than a second line width in the second region;
- a first die hybrid-bonded to the first region through conductive features adapted for the first line width;
- and
- a second die bonded to the second region through conductive features adapted for the second line width.
A system-in-package (SIP) structure, comprising:
- a substrate having a patterned surface, the patterned surface comprising a first conductive pattern and a second conductive pattern;
- a first die hybrid-bonded to the first conductive pattern of the patterned surface through conductive features adapted for the first conductive pattern;
- and
- a second die bonded to the second conductive pattern of the patterned surface through conductive features adapted for the second conductive pattern.
A method for manufacturing a semiconductor package structure, comprising:
- providing a substrate having a patterned surface, the patterned surface comprising a first conductive pattern and a second conductive pattern,
- performing a planarization operation on the patterned surface, the first conductive pattern having a first dishing response to a planarization operation, and the second conductive pattern having a second dishing response to the planarization operation, the first dishing response being different from the second dishing response;
- hybrid-bonding a first die to the first region through conductive features adapted for the first conductive pattern;
- and
- bonding a second die to the first region through conductive features adapted for the second conductive pattern.
Dependencies are inferred from the claim text.