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US 10,854,548 B2Granted
Inter-die passive interconnects approaching monolithic performance
AssigneeIntel Corporation
InventorsZuoguo Wu, Debendra Das Sharma, Adel A. Elsherbini, Gerald Pasdast
Life of this patent
Estimating the term…
Abstract
Inter-die passive interconnects are lengthened while locating I/O circuitry away from die edge, such that passive interconnect length is agglomerated toward the die edge, and inter-die communication is expedited.
Claims21
A multi-chip package comprising:
- a first semiconductive device including a first-die, first input-output circuitry;
- a first-die, first on-die routing in contact with the first-die, first input-output circuitry and in contact with a first-die, first electrical contact;
- a bridge die in contact with the first-die, first electrical contact;
- a bridge-die, first passive routing in contact with the first-die, first electrical contact;
- a second semiconductive device in contact with a second-die, first electrical contact that is on the bridge die and in contact with the bridge-die, first passive routing;
- a first-die, second on-die routing that contacts a first-die, second electrical contact;
- a bridge-die, second passive routing on the bridge die that is in contact with the first-die, second electrical contact;
- wherein the bridge-die, second passive routing is coupled to the second die at a second-die contact;
- and
- wherein the bridge-die, second passive routing is in a metallization strata vertically adjacent the bridge-die, first passive routing.
7 more elements
A multi-chip package comprising:
- a first die with signal routing, including:
- a converged mesh-stop (CMS) region adjacent a core logic region;
- first on-die input-output (I/O) circuitry adjacent the CMS region and spaced apart from a modular die-fabric interconnect (MDFI);
- first-die, first on-die passive routing between the first on-die I/O circuitry and a first electrical contact that contacts a bride die, wherein the first electrical contact is closest to a first edge of the bridge die;
- bridge-die passive routing on the bridge die between the first electrical contact and a second electrical contact on the bridge die, wherein the second electrical contact is closest to a second edge of the bridge die;
- and
- a second die that contacts the second electrical contact.
4 more elements
Dependencies are inferred from the claim text.