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US 10,854,547 B2Granted
Chip package with cross-linked thermoplastic dielectric
AssigneeInfineon Technologies AG
InventorsJoachim Mahler, Georg Meyer-Berg, Guenter Tutsch
Life of this patent
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Abstract
A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.
Claims18
A package, comprising:
- an electronic chip;
- and
- a dielectric structure comprising a highly filled cross-linked thermoplastic material, wherein the dielectric structure comprises or consists of an encapsulant at least partially encapsulating the electronic chip, wherein the cross-linked thermoplastic material comprises chains connected by a cross-linking structure, wherein the cross-linked thermoplastic material has a degree of cross-linking in a range between 2% and 90%, and wherein the degree of cross-linking is a percentage of repetitive monomer units in the chains of the cross-linked thermoplastic material.
A package, comprising:
- an electronic chip;
- and
- a dielectric structure covering at least part of the electronic chip and comprising an optically opaque cross-linked thermoplastic material, wherein the cross-linked thermoplastic material comprises chains connected by a cross-linking structure, wherein the cross-linked thermoplastic material has a degree of cross-linking in a range between 2% and 90%, and wherein the degree of cross-linking is a percentage of repetitive monomer units in the chains of the cross-linked thermoplastic material.
A method of manufacturing a package, the method comprising:
- mounting an electronic chip on a chip carrier;
- and
- forming a dielectric structure covering at least part of the electronic chip by cross-linking a highly filled thermoplastic material, wherein cross-linking the highly filled thermoplastic material comprises connecting chains by a cross-linking structure, wherein the highly filled thermoplastic material has a degree of cross-linking in a range between 2% and 90%, and wherein the degree of cross-linking is a percentage of repetitive monomer units in the chains of the highly filled thermoplastic material.
Dependencies are inferred from the claim text.