Ground via clustering for crosstalk mitigation
AssigneeIntel Corporation
InventorsZhiguo Qian, Kemal Aygun, Yu Zhang
Life of this patent
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Abstract
Embodiments of the present disclosure are directed towards techniques and configurations for ground via clustering for crosstalk mitigation in integrated circuit (IC) assemblies. In some embodiments, an IC package assembly may include a first package substrate configured to route input/output (I/O) signals and ground between a die and a second package substrate. The first package substrate may include a plurality of contacts disposed on one side of the first package substrate and at least two ground vias of a same layer of vias, and the at least two ground vias may form a cluster of ground vias electrically coupled with an individual contact. Other embodiments may be described and/or claimed.
Claims20
A semiconductor package, comprising:
- a package substrate having a first side and a second side, the first side opposite the second side, the package substrate comprising:
- ball pad on the second side of the package substrate;
- and
- a vertical interconnect between the first side and the second side of the package substrate, the vertical interconnect comprising a first ground conductive via laterally adjacent to a second ground conductive via, wherein the first ground conductive via and the second ground conductive via are both in direct contact with the ball pad;
- a die coupled to the first side of the package substrate, the die having a footprint;
- and
- a solder ball coupled to the bond pad on the second side of the package substrate, the solder ball outside of the footprint of the die.
A method of fabricating a semiconductor package, the method comprising:
- providing a package substrate having a first side and a second side, the first side opposite the second side, the package substrate comprising:
- a ball pad on the second side of the package substrate;
- and
- a vertical interconnect between the first side and the second side of the package substrate, the vertical interconnect comprising a first ground conductive via laterally adjacent to a second ground conductive via, wherein the first ground conductive via and the second ground conductive via are both in direct contact with the ball pad;
- coupling a die coupled to the first side of the package substrate, the die having a footprint;
- and
- coupling a solder ball coupled to the bond pad on the second side of the package substrate, the solder ball outside of the footprint of the die.
Dependencies are inferred from the claim text.