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US 10,854,533 B2Granted
Semiconductor package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChung Hao Chen, Chin-Cheng Kuo
Life of this patent
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Abstract
A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.
Claims19
A semiconductor package, comprising:
- a substrate;
- a microelectromechanical device disposed on the substrate;
- an interconnection structure connecting the substrate to the microelectromechanical device;
- and
- a metallic sealing structure surrounding the interconnection structure, wherein the substrate has a surface facing toward the microelectromechanical device and the microelectromechanical device has a surface facing towards the substrate, and the metallic sealing structure comprises:
- a first sealing structure disposed on the surface of the substrate;
- and
- a second sealing structure disposed on a surface of the microelectromechanical device,
- wherein the first sealing structure and the second sealing structure are connected to each other.
6 more elements
A semiconductor package, comprising:
- a substrate having a first surface and a second surface opposite to the first surface, defining an opening, and comprising a conductive post disposed in the opening;
- a microelectromechanical device disposed on the substrate;
- an interconnection structure disposed between the substrate and the microelectromechanical device;
- a sealing structure disposed between the substrate and the microelectromechanical device;
- a first conductive pattern disposed on the first surface of the substrate and facing toward the microelectromechanical device;
- and
- a second conductive pattern disposed on the second surface of the substrate,
- wherein the first conductive pattern is electrically connected to the second conductive pattern through the conductive post, and
- the interconnection structure is surrounded by the sealing structure.
6 more elements
Dependencies are inferred from the claim text.