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US 10,854,532 B1Granted
Compressed air and lattice structure cooling
AssigneeFacebook, Inc.
InventorsAhmad Byagowi, Spencer John Paul Burns
Life of this patent
Estimating the term…
Abstract
Compressed air and lattice structure cooling is disclosed. In an embodiment, an assembly includes a heat conductive lattice structure with open-cell voids. The assembly also includes a port configured to provide compressed air that is directed toward the heat conductive lattice structure. The assembly also includes a base configured to be coupled to an electronic component and thermally coupled to the heat conductive lattice structure.
Claims20
An assembly, comprising:
- a heat conductive lattice structure with open-cell voids;
- a port configured to provide compressed air that is directed toward the heat conductive lattice structure;
- an air flow spreader configured to receive the compressed air provided via the port and distribute the compressed air through one or more airflow pathways to one or more outlets facing the heat conductive lattice structure, wherein the one or more airflow pathways are in a configuration in which an airflow pathway pattern recurs in substantially similar form at progressively smaller scales;
- and
- a base configured to be coupled to an electronic component and thermally coupled to the heat conductive lattice structure.
2 more elements
A method, comprising:
- providing compressed air via a port;
- directing the compressed air toward a heat conductive lattice structure with open-cell voids;
- utilizing an air flow spreader to receive the compressed air provided via the port and distribute the compressed air through one or more airflow pathways to one or more outlets facing the heat conductive lattice structure, wherein the one or more airflow pathways are in a configuration in which an airflow pathway pattern recurs in substantially similar form at progressively smaller scales;
- and
- cooling, via the compressed air, an electronic component coupled to a base that is thermally coupled to the heat conductive lattice structure.
2 more elements
An assembly, comprising:
- a heat conductive lattice structure with open-cell voids;
- a port configured to provide compressed air that is directed toward the heat conductive lattice structure;
- an air flow spreader configured to receive the compressed air provided via the port and distribute the compressed air through one or more airflow pathways to one or more outlets facing the heat conductive lattice structure, wherein the one or more airflow pathways are in a configuration associated with an H-tree fractal;
- and
- a base configured to be coupled to an electronic component and thermally coupled to the heat conductive lattice structure.
2 more elements
Dependencies are inferred from the claim text.