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US 10,854,529 B2Granted
High resistivity wafer with heat dissipation structure and method of making the same
AssigneeUnited Microelectronics Corp.
InventorsPurakh Raj Verma, Kuo-Yuh Yang, Chia-Huei Lin
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Abstract
A high resistivity wafer with a heat dissipation structure includes a high resistivity wafer and a metal structure. The high resistivity wafer includes a heat dissipation region and a device support region. The high resistivity wafer consists of an insulating material. The metal structure is only embedded within the heat dissipation region of the high resistivity wafer. The metal structure surrounds the device support region.
Claims11
A high resistivity wafer with a heat dissipation structure, comprising:
- a high resistivity wafer comprising a heat dissipation region and a device support region, wherein the high resistivity wafer consists of an insulating material;
- and
- a metal structure embedded only within the heat dissipation region of the high resistivity wafer, wherein the metal structure surrounds the device support region
- a device wafer covering the high resistivity wafer, the device wafer comprising a device region, and an edge region, wherein no device is disposed within the edge region;
- and
- a semiconductor device disposed within the device region, wherein the device region entirely overlaps the device support region, and the edge region overlaps the heat dissipation region.
3 more elements
Dependencies are inferred from the claim text.